ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,939, issued on Aug. 18, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Pre-molded lead frames for semiconductor packages" ... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,940, issued on Aug. 18, was assigned to Nexperia B.V. (Nijmegen, Netherlands). "Power semiconductor device attached to a lead frame" was in... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,941, issued on Aug. 18, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor module" was invented by Katsunori Suzuki (... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,942, issued on Aug. 18, was assigned to Adeia Semiconductor Bonding Technologies Inc. (San Jose, Calif.). "Chiplet-to-chiplet protocol swit... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,943, issued on Aug. 18, was assigned to Adeia Semiconductor Technologies LLC (San Jose, Calif.). "Dielets on flexible and stretchable packa... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,944, issued on Aug. 18, was assigned to STMicroelectroncis (Grenoble 2) SAS (Grenoble, France). "QFN package comprising two electronic chip... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,945, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Wiring substrate and semiconductor package i... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,946, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor packages" was invented by Jung... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,947, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Via array in a redistribution l... और पढ़ें
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,948, issued on Aug. 18, was assigned to Wolfspeed Inc. (Durham, N.C.). "Transistor package and process of implementing the transistor packa... और पढ़ें